This image shows Stefan Oechsle

Stefan Oechsle

M.Sc.

Research Assistant "Real-time communication and control hardware"
Institute for Control Engineering of Machine Tools and Manufacturing Units

Contact

Seidenstr. 36
70174 Stuttgart
Deutschland
Room: 5.021

Office Hours

By appointment.

Subject

  • Time-Sensitive Networking (TSN)
  • Engineering of converged networks and distributed real-time applications
Publications:
  1. Reiff, Colin ; Oechsle, Stefan ; Eger, Florian ; Verl, Alexander: Web-based Platform for Data Analysis and Monitoring. In: Procedia CIRP, Procedia CIRP. Bd. 86 (2019), S. 31–36. — 7th CIRP Global Web Conference
  2. Oechsle, Stefan ; Frick, Florian ; Lechler, Armin ; Verl, Alexander: A modular configuration and management framework for distributed real-time applications based on converged networks using TSN. In: Procedia CIRP, Procedia CIRP. Bd. 118 : Elsevier BV, 2023, S. 38--43
  3. Neubauer, Michael ; Reiff, Colin ; Walker, Moritz ; Oechsle, Stefan ; Lechler, Armin ; Verl, Alexander: Cloud-based evaluation platform for software-defined manufacturing - Stuttgarter Maschinenfabrik as a realization example of an Industry 4.0 production. In: at - Automatisierungstechnik, at - Automatisierungstechnik. Bd. 71 (2023), Nr. 5, S. 351--363
  4. Oechsle, Stefan ; Walker, Moritz ; Fischer, Marc ; Frick, Florian ; Lechler, Armin ; Verl, Alexander: Real-Time Capable Architecture for Software-Defined Manufacturing. In: 2036, A. (Hrsg.) ; 2036, A. (Hrsg.): . Bd. Advances in Automotive Production Technology – Towards Software-Defined Manufacturing and Resilient Supply Chains : Springer, 2023 — ISBN 978-3-031-27932-4, S. 3–13
  5. Walker, Moritz ; Klingel, Lars ; Oechsle, Stefan ; Neubauer, Michael ; Lechler, Armin ; Verl, Alexander: Safeguarded Continuous Deployment of Control Containers through Real-Time Simulation. In: 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA), 2023 IEEE 28th International Conference on Emerging Technologies and Factory Automation (ETFA), 2023, S. 1–8
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